Automated Thermal Resistance Test System

Vektrex Automated Thermal Resistance Test System is a tool to automate thermal resistance measurement and calculations. The tool is applicable for use with single devices, devices mounted on load boards and individually addressable, or wafer probing.  

Device abnormalities may be detected and devices replaced or skipped prior to starting a long term burn-in and reliability test. With burn-in/reliability applications, devices are generally mounted on load boards/load plates or metal core printed circuit boards (MCPCB).   Mounting/assembly failures that cannot be detected during the manufacturing process may be detected using the Automated Thermal Resistance Test System. Automated thermal resistance and/or Junction Temperature measurement is also applicable to wafer level burn-in and for optimizing wafer level burn-in. By detecting device failures and stability prior to starting a long term test and/or early in the long term reliability and burn-in test, processes may be optimized saving time and money. The tool validates each device presenting a screen map of device status (pass/fail). The tool is easy to use and customizable.   

Vektrex Thermal Resistance Software
Figure 1: Vektrex Automated Thermal Resistance Test Tool

The Automated Thermal Resistance Test System is based upon Vektrex Performance Series Precision Pulsed Current Sources; single or multiple source channel models. 

Contact Vektrex to learn more about the automated thermal resistance test system software application.