MicReD T3Ster

MicReD® (Microelectronics Research and Development) produces the T3Ster® family of products. The T3Ster specializes in highly-detailed, fast, accurate thermal testing, measurement, and characterization of IC packages, LEDs, and systems. When combined with a series of add-ons to form a thermal resistance testing system, the T3Ster allows qualification of thermal interfaces (i.e. die attach layers and TIMs (thermal interface materials). This testing technology is based on thermal transient measurements and completed by complex post-processing. The T3Ster and its associated components are suitable for the analyzing the complex thermal structures of a device. T3Ster is appropriate for application during the R&D and design phases for chips.

Vektrex Tj Utility

Vektrex Tj Utility differs from MicRed T3Ster in application. The Tj Utility is a simple, easy-to-use semi-automated product that is applicable for use with packaged devices including luminaires. The Tj Utility leverages SpikeSafe Performance Series Current Source capabilities, providing Tj/thermal resistance calculations for voltages to 400V, currents to 60A. For more information please contact us.

For more information about MicReD’s T3Ster, read on.

Structure Functions

Structure function analysis is the most important feature of T3Ster measurements. Structure functions are used to evaluate the thermal structure of a device. This is accomplished by measuring the thermal transient response in an electrical test method as standardized in JEDEC JESD 51-1. Specifically, structure functions track the heat flow path from the die junction to the ultimate ambient.

Structure Functions Detail Thermal Structure
Structure Functions Detail Thermal Structure

Structure functions are used to identify junction-to-ambient and junction-to-case thermal resistance, partial thermal resistance, geometrical dimensions of heat-flow paths, and structural degradation.

Software & Hardware Add-Ons

The T3Ster base configuration consists of a power driving module, sensor current sources, up to 8 measurement channels, and a basic software interface. This setup enables basic powering and measuring thermal response. To accomplish post-processing and access a variety of other features, add-ons are required. Optional add-ons include T3Ster Master Software, additional measurement channels, power boosters, system extensions, and others.

Features Enabled by Hardware Add-Ons

  • JEDEC compliant thermal resistance measurements
  • Accurate temperature measurements
  • 1µs measurement resolution
  • Real-time measurement

Applicable Industries & Applications

  • Aerospace & Defense
    • Thermal conductivity measurement of TIMs
    • Thermal resistance of IC chips and MOSFETs
  • Automotive & Transport
    • Standard component testing (RthJC)
    • Multiple channels for testing multi-die packages
    • Structure function analysis
  • Consumer Electronics
    • Thermal characterization
    • Validation of CFD models of IC packages by applying DELPHI dual coldplate setups
  • Semiconductors
    • Development of new packing solutions
  • Solid-State Lighting
    • Thermal testing
    • Compliance with JEDEC JESD51-14, JESD51-51, and JESD51-52
    • LED reliability monitoring
    • Compact modeling of LED packages for CFD-based luminaire-level thermal analysis
Learn More About T3Ster

The information on this page is sourced from posted data on the Mentor Graphics website.